High device flexibility:

Different chamber sizes, inner diameters ranging from 710 mm to 2810 mm. This means we can provide chambers to perfectly match the loading capacity and substrate size defined by customers.

The system can be optimized for DUV applications:

The system solution optimized for 193 nm wavelength lithography applications. These solutions include specially treated chamber surfaces, selected materials, and personalized component configurations to ensure extremely low coating losses. These measures are also crucial in oxide coating applications that require high reflectivity, non offset stable mirror coating for generating DUV applications.

Availability for IR applications:

To meet the special requirements of IR applications, the equipment design can be perfectly debugged and its components can cope with a large amount of IR coating materials. Excellent layer performance can be applied to flat and highly curved substrates coating that require good uniformity on the entire surface.